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PMDPB70XP,115 - Nexperia

Description: 30 V, dual P-channel Trench MOSFET plastic thermal enhanced ultra thin small outline package; noleads; 6 terminals ,SOT1118.

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PCB Footprints
PMDPB70XP,115 - Nexperia PCB footprint - Other - Other - PMDPB70XP,115-1
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3D Models
PMDPB70XP,115 - Nexperia  - 3D model - Other - PMDPB70XP,115-1
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PMDPB70XP,115 Details

  • Manufacturer Part Number:

    PMDPB70XP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOT-1118, HUSON-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT1118

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.9 A

  • Drain-source On Resistance-Max:

    0.087 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    S-PDSO-N6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    8.3 W

  • Pulsed Drain Current-Max (IDM):

    11.6 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMDPB70XP,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PMDPB70XP,115 is a standard SOT23 package with a minimum pad size of 1.5 mm x 1.5 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure reliable operation of PMDPB70XP,115 in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of PMDPB70XP,115 is 6.5V, exceeding which may cause damage to the device.
  • Yes, PMDPB70XP,115 can be used in a switching regulator application, but it is recommended to follow proper design guidelines and ensure that the device is operated within its specified ratings and limitations.
  • To handle ESD protection for PMDPB70XP,115, it is recommended to follow proper ESD handling and storage procedures, including using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.

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PMDPB70XP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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