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PMEG030V030EPDZ - Nexperia

Description: Nexperia 30V 4.2A, Schottky Diode, 2 + Tab-Pin SOD-123 PMEG030V030EPDZ

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PCB Footprints
PMEG030V030EPDZ - Nexperia PCB footprint - Other - Other - PMEG030V030EPDZ-3
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PMEG030V030EPDZ - Nexperia  - 3D model - Other - PMEG030V030EPDZ-3
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PMEG030V030EPDZ Details

  • Manufacturer Part Number:

    PMEG030V030EPDZ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DFP

  • Package Description:

    SOT-1289, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1289

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    30 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-F3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Reverse Recovery Time-Max:

    0.016 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

PMEG030V030EPDZ Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid copper plane underneath the device to improve thermal performance. A minimum of 2 oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • To ensure reliable operation at high temperatures, it is essential to follow proper thermal design and layout guidelines. Additionally, Nexperia recommends derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The maximum allowable voltage stress on the PMEG030V030EPDZ is 30V. Exceeding this voltage may cause permanent damage to the device.
  • Yes, the PMEG030V030EPDZ is suitable for high-reliability applications. Nexperia provides a range of reliability data, including FIT rates and MTBF, to support the device's use in such applications.
  • Nexperia recommends following standard ESD handling and assembly procedures to prevent damage to the device. This includes using ESD-protected workstations, wrist straps, and packaging materials.

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PMEG030V030EPDZ Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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