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PMEG10010ELR - Nexperia

Description: NEXPERIA - PMEG10010ELR - SCHOTTKY RECT, 1A, 100V, SMD

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PMEG10010ELR - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123W
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PMEG10010ELR - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD-123W
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PMEG10010ELR Details

  • Manufacturer Part Number:

    PMEG10010ELR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123W, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-02-17

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.77 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.68 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    0.15 µA

  • Reverse Recovery Time-Max:

    0.0037 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG10010ELR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for PMEG10010ELR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Avoid overheating, and monitor the device's junction temperature (Tj) to prevent thermal runaway.
  • The recommended soldering conditions for PMEG10010ELR are: peak temperature 260°C, soldering time 10-30 seconds, and a soldering iron temperature of 350-370°C. Use a solder with a melting point above 217°C, and avoid using excessive soldering flux or cleaning solvents that can damage the device.
  • Handle the device with care to prevent mechanical stress, bending, or twisting. Store the device in its original packaging or a similar protective package, and avoid exposing it to moisture, dust, or extreme temperatures. Use electrostatic discharge (ESD) protection when handling the device, and avoid touching the device's pins or leads.
  • PMEG10010ELR is manufactured according to Nexperia's quality and reliability standards, which include ISO/TS 16949, ISO 9001, and AEC-Q100. The device is also qualified according to the Automotive Electronics Council (AEC) standards for automotive applications.

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PMEG10010ELR Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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