PMEG2005AESFYL footprint, schematic symbol and 3D model by Nexperia

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PCB Footprints

PMEG2005AESFYL - Nexperia PCB footprint - Other - Other - DSN0603-2 (SOD962-2)-as

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Part Number PMEG2005AESFYL
Manufacturer Nexperia
Pin Count 2
Part Category Schottky Diode
Package Category Other
Footprint Name Other - DSN0603-2 (SOD962-2)-as
Released Date Mar 14, 2026
Last Modified Date Mar 15, 2026 9:29 PM UTC
Pinout / Pin List Click Here (Member Only)

PMEG2005AESFYL Details

Manufacturer Part Number:
PMEG2005AESFYL
Brand Name:
Nexperia
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
DSN0603-2, 2 PIN
Pin Count:
2
Manufacturer Package Code:
SOD962-2
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
8 Weeks
Manufacturer:
Nexperia
YTEOL:
5
Application:
GENERAL PURPOSE
Breakdown Voltage-Min:
20 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.55 V
JESD-30 Code:
R-PBCC-N2
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
4.5 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
0.71 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
0.66 W
Reference Standard:
IEC-60134
Rep Pk Reverse Voltage-Max:
20 V
Reverse Current-Max:
45 µA
Reverse Recovery Time-Max:
0.0019 µs
Reverse Test Voltage:
20 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40

PMEG2005AESFYL Frequently Asked Questions (FAQs)

A good PCB layout for PMEG2005AESFYL should have a solid ground plane, a small thermal pad, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer PCB is recommended. Refer to Nexperia's application note AN11542 for more details.
To ensure reliability, follow Nexperia's recommended operating conditions, and consider derating the device's power dissipation at high temperatures. Implement a robust thermal management system, and ensure good airflow around the device. Monitor the device's junction temperature (Tj) and adjust the system design accordingly.
The PMEG2005AESFYL has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing and assembly. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and follow Nexperia's guidelines for PCB design and layout.
Choose input and output capacitors with low ESR, high ripple current capability, and a voltage rating that meets or exceeds the maximum input voltage. X5R or X7R ceramic capacitors are recommended. Refer to Nexperia's application note AN11542 for more information on capacitor selection.
For high-power applications, ensure good thermal conductivity between the device and the PCB. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK. Implement a heat sink or a thermal management system to keep the device's junction temperature (Tj) below 150°C.

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PMEG2005AESFYL Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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