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PMEG2005EH,115 - Nexperia

Description: Schottky Diodes & Rectifiers PMEG2005EH/SOD123F/SOD2

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PMEG2005EH,115 - Nexperia - PCB symbol
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PMEG2005EH,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - AMC1311QDWVQ1
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PMEG2005EH,115 - Nexperia - 3D model - Small Outline Diode Flat Lead - AMC1311QDWVQ1
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PMEG2005EH,115 Details

  • Manufacturer Part Number:

    PMEG2005EH,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD123F

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.39 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.83 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2005EH,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for PMEG2005EH,115 should have a solid ground plane, a small thermal pad, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer board with a thermal relief pattern is recommended.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce the thermal resistance.
  • The recommended soldering profile for PMEG2005EH,115 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. A soldering iron with a temperature range of 200-420°C is recommended.
  • Yes, PMEG2005EH,115 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 standard for automotive reliability and is manufactured using a high-reliability process.
  • To prevent damage, store PMEG2005EH,115 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.

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PMEG2005EH,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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