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PMEG2005EL,315 - Nexperia

Description: Diode Schottky 20 V 500mA (DC) Surface Mount DFN1006-2

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PMEG2005EL,315 - Nexperia PCB footprint - Other - Other - PMEG2005EL,315-2
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PMEG2005EL,315 - Nexperia  - 3D model - Other - PMEG2005EL,315-2
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PMEG2005EL,315 Details

  • Manufacturer Part Number:

    PMEG2005EL,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2005EL,315 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (up to 150°C), use a suitable thermal interface material, and provide adequate heat sinking. Also, consider derating the device's power handling capabilities at higher temperatures.
  • The PMEG2005EL,315 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or leads.
  • Yes, the PMEG2005EL,315 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 standard for automotive reliability and is designed for harsh environments. However, ensure that you follow the recommended operating conditions and derating guidelines.
  • To troubleshoot issues, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout is correct. Use thermal imaging or temperature measurement tools to identify hotspots. Consult the datasheet and application notes for guidance on troubleshooting and fault diagnosis.

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PMEG2005EL,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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