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PMEG2005EPK,315 - Nexperia

Description: Diode Schottky 20V 0.7A 2-Pin SMD T/R - Bulk

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PMEG2005EPK,315 - Nexperia - PCB symbol
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PCB Footprints
PMEG2005EPK,315 - Nexperia PCB footprint - Other - Other - SOD1608 (DFN1608D-2)
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3D Models
PMEG2005EPK,315 - Nexperia - 3D model - Other - SOD1608 (DFN1608D-2)
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PMEG2005EPK,315 Details

  • Manufacturer Part Number:

    PMEG2005EPK,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-1608, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD1608

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.08

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.41 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.39 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    300 µA

  • Reverse Recovery Time-Max:

    0.003 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2005EPK,315 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid copper plane underneath the device to improve thermal performance. A minimum of 2 oz copper thickness is recommended, and the copper plane should be connected to a heat sink or a thermal pad.
  • To ensure reliable operation at high temperatures, it's essential to follow Nexperia's recommended thermal design guidelines, including using a heat sink, thermal interface material, and ensuring good airflow around the device. Additionally, derating the device's power dissipation according to the temperature derating curve is crucial.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is 6.5V, which is higher than the recommended 5V. However, exceeding 5V may reduce the device's reliability and lifespan.
  • The PMEG2005EPK,315 is not hermetically sealed, so it's not suitable for high-humidity environments. If your application requires operation in humid conditions, consider using a hermetically sealed device or taking additional precautions, such as conformal coating or potting, to protect the device from moisture.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. It's essential to follow a controlled soldering process to prevent damage to the device.

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PMEG2005EPK,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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