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PMEG2010EJ,115 - Nexperia

Description: Schottky Diodes & Rectifiers SCHOTTKY 20V 1A

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PCB Footprints
PMEG2010EJ,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD323F
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3D Models
PMEG2010EJ,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD323F
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PMEG2010EJ,115 Details

  • Manufacturer Part Number:

    PMEG2010EJ,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-90, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323F

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    9 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.35 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2010EJ,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure the device operates within the SOA, monitor the voltage, current, and power dissipation to prevent overheating, and ensure the device is not exposed to excessive voltage or current stress.
  • The recommended soldering conditions for the PMEG2010EJ,115 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that prevents thermal shock.
  • Handle the device with care to prevent mechanical stress, store it in a dry and clean environment, and use anti-static packaging to prevent electrostatic discharge (ESD) damage.
  • Nexperia follows the AEC-Q100 and IATF 16949 standards for automotive-grade reliability and quality, ensuring the device meets stringent requirements for automotive applications.

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PMEG2010EJ,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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