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PMEG3002ESFYL - Nexperia

Description: Schottky Diodes & Rectifiers 30V 0.2A MEGA Schottky

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Symbol
PMEG3002ESFYL - Nexperia - PCB symbol
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PCB Footprints
PMEG3002ESFYL - Nexperia PCB footprint - Other - Other - DSN0603-2 (SOD962-2)_1
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3D Models
PMEG3002ESFYL - Nexperia - 3D model - Other - DSN0603-2 (SOD962-2)_1
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PMEG3002ESFYL Details

  • Manufacturer Part Number:

    PMEG3002ESFYL

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-962, DSN0603, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD962-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-04-24

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.45

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.535 V

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.405 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    9 µA

  • Reverse Recovery Time-Max:

    0.00142 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG3002ESFYL Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, make sure to follow the recommended derating curves for the device, and consider using a heat sink or thermal interface material to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's essential to ensure that the device operates within the recommended temperature range.
  • Yes, the PMEG3002ESFYL is a high-reliability device that meets the requirements for automotive and aerospace applications. However, it's essential to follow the recommended design and testing procedures to ensure compliance with industry standards.
  • To troubleshoot issues with the device, start by checking the input voltage, output current, and thermal conditions. Use oscilloscopes and thermal imaging cameras to monitor the device's behavior and identify potential issues.

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PMEG3002ESFYL Overview

Use the download button to access the PMEG3002ESFYL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PMEG3, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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