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PMEG3005AEA - Nexperia

Description: PMEG3005AEA, Schottky Diode, 0.5A max, 30V, 2-Pin, UMD

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PMEG3005AEA - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323 (SC-76)
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PMEG3005AEA - Nexperia  - 3D model - Small Outline Diode - SOD323 (SC-76)
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PMEG3005AEA Details

  • Manufacturer Part Number:

    PMEG3005AEA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-76, 2 PIN

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.43 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3005AEA Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid copper plane on the bottom layer, connected to the thermal pad of the PMEG3005AEA, to ensure good heat dissipation. A minimum of 2oz copper thickness is recommended.
  • Nexperia recommends using a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a solder with a melting point of 217°C or higher.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • The PMEG3005AEA is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and voltage ratings according to the temperature derating curve provided in the datasheet.
  • The power dissipation of the PMEG3005AEA can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency of the device can be found in the datasheet. It is recommended to use a thermal model or simulation tool to accurately calculate the power dissipation and junction temperature of the device.

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PMEG3005AEA Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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