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PMEG3005EL,315 - Nexperia

Description: Schottky Diode 30 V 500mA Surface Mount DFN1006-2

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Symbol
PMEG3005EL,315 - Nexperia - PCB symbol
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PCB Footprints
PMEG3005EL,315 - Nexperia PCB footprint - Other - Other - DFN1006-2_20
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3D Models
PMEG3005EL,315 - Nexperia - 3D model - Other - DFN1006-2_20
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PMEG3005EL,315 Details

  • Manufacturer Part Number:

    PMEG3005EL,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-17

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.08

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3005EL,315 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the thermal pad away from other components and traces can help reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure good thermal design, use a heat sink if necessary, and consider derating the device at high temperatures.
  • A low-ESR ceramic capacitor with a value of 4.7 μF to 10 μF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • To minimize EMI, use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke or ferrite bead on the output. Additionally, ensure good PCB layout practices, such as keeping the power stage away from sensitive analog circuits.
  • A low-ESR ceramic capacitor with a value of 10 μF to 22 μF is recommended for output decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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PMEG3005EL,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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