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PMEG3015EJ,115 - Nexperia

Description: Nexperia PMEG3015EJ,115 SMT Schottky Diode, 30V 1.5A, 2-Pin SOD-323F

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PCB Footprints
PMEG3015EJ,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD323F
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3D Models
PMEG3015EJ,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD323F
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PMEG3015EJ,115 Details

  • Manufacturer Part Number:

    PMEG3015EJ,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-90, SOD-323F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323F

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    9 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.83 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3015EJ,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the components away from the thermal pad and using a thermal interface material can help to improve thermal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Avoid applying excessive force or pressure, which can damage the device.
  • Handle the device by the body, not the leads, to prevent damage. Avoid touching the leads or any other exposed metal parts to prevent electrostatic discharge (ESD) damage. Use an anti-static wrist strap or mat, and ensure the workspace is ESD-safe.
  • The input capacitor value depends on the input voltage, output voltage, and output current. A general rule of thumb is to use a capacitor with a value of 10uF to 22uF, with a voltage rating of at least 1.5 times the input voltage. However, it's recommended to consult the application note or a Nexperia representative for specific guidance.
  • Thermal design considerations include providing a good thermal path from the device to the PCB, using thermal vias, and keeping the device away from heat sources. The device's thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.

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PMEG3015EJ,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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