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PMEG3030BEP - Nexperia

Description: PMEG3030BEP NXP SMT Schottky Diode, 30V 3A, 2-Pin SOD-128

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PMEG3030BEP - Nexperia - PCB symbol
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PCB Footprints
PMEG3030BEP - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD 128
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3D Models
PMEG3030BEP - Nexperia - 3D model - Small Outline Diode Flat Lead - SOD 128
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PMEG3030BEP Details

  • Manufacturer Part Number:

    PMEG3030BEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-128, 2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.12

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG3030BEP Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid ground plane and a thermal pad connected to the ground plane to improve thermal performance. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation at high temperatures, Nexperia recommends following the recommended operating conditions, using a suitable heat sink, and ensuring good thermal conductivity between the device and the heat sink.
  • The maximum allowed voltage on the enable pin (EN) is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the voltage on the EN pin does not exceed 6V to prevent damage to the device.
  • Yes, the PMEG3030BEP is suitable for high-frequency switching applications up to 2 MHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency does not exceed the device's capabilities.
  • To calculate the power dissipation of the PMEG3030BEP, you need to consider the device's voltage drop, current rating, and thermal resistance. Nexperia provides a power dissipation calculation formula in the datasheet, which can be used to estimate the power dissipation based on the application's specific requirements.

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PMEG3030BEP Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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