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PMEG3050BEP,115 - Nexperia

Description: Nexperia PMEG3050BEP,115 SMT Schottky Diode, 30V 5A, 2-Pin SOD-128

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PCB Footprints
PMEG3050BEP,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD128
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3D Models
PMEG3050BEP,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD128
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PMEG3050BEP,115 Details

  • Manufacturer Part Number:

    PMEG3050BEP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    70 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    250 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG3050BEP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device, and ensure that the PCB is designed to handle the increased thermal stress.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's crucial to ensure that the device operates within the recommended temperature range.
  • While the PMEG3050BEP,115 is designed to operate in a wide range of environments, it's still important to take precautions when operating in high-humidity environments. Consider using conformal coating or other moisture-protection measures to ensure reliable operation.
  • To troubleshoot issues with the PMEG3050BEP,115, start by checking the input and output voltages, and verifying that the device is properly soldered to the PCB. If issues persist, consult the datasheet and application notes for guidance.

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PMEG3050BEP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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