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PMEG3050EP,115 - Nexperia

Description: NXP PMEG3050EP,115 SMT Schottky Diode, 30V 5A, 2-Pin SOD-128

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PCB Footprints
PMEG3050EP,115 - Nexperia PCB footprint - Other - Other - SOD128
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PMEG3050EP,115 - Nexperia  - 3D model - Other - SOD128
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PMEG3050EP,115 Details

  • Manufacturer Part Number:

    PMEG3050EP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.36 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    70 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    8000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG3050EP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal interface material with a high thermal conductivity coefficient.
  • The recommended soldering conditions for PMEG3050EP,115 are: peak temperature 260°C, soldering time 10-30 seconds, and a soldering iron temperature of 350°C. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • To handle ESD protection for PMEG3050EP,115, follow proper handling and storage procedures, use ESD-protective packaging, and ensure that the device is properly grounded during handling and assembly. Additionally, consider using ESD protection devices or circuits in the application.
  • The recommended storage conditions for PMEG3050EP,115 are: temperature range -40°C to 125°C, relative humidity < 90%, and protection from moisture and contamination. Store the devices in their original packaging or in a dry, clean environment.

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PMEG3050EP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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