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PMEG4005CT,215 - Nexperia

Description: Diode Array 1 Pair Common Cathode 40 V 500mA Surface Mount TO-236-3, SC-59, SOT-23-3

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PCB Footprints
PMEG4005CT,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23  (TO-236AB)
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3D Models
PMEG4005CT,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23  (TO-236AB)
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PMEG4005CT,215 Details

  • Manufacturer Part Number:

    PMEG4005CT,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.33 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Recovery Time-Max:

    0.013 µs

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG4005CT,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the thermal pad away from other components and traces can help reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure good thermal design, use a heat sink if necessary, and consider derating the device's power handling at high temperatures.
  • The PMEG4005CT,215 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and follow the recommended operating conditions.
  • The PMEG4005CT,215 is an AEC-Q100 qualified device, making it suitable for automotive applications. However, for high-reliability applications, it's essential to follow the recommended operating conditions, and consider additional testing and validation to ensure the device meets the specific application requirements.
  • Follow the recommended soldering and assembly procedures outlined in the Nexperia application note AN10364, which provides guidelines for reflow soldering, wave soldering, and manual soldering.

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PMEG4005CT,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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