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PMEG4010BEA - Nexperia

Description: NEXPERIA - PMEG4010BEA - DIODE, SCHOTTKY, SOD-323

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PMEG4010BEA - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - PMEG4010BEA
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PMEG4010BEA - Nexperia  - 3D model - Small Outline Diode - PMEG4010BEA
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PMEG4010BEA Details

  • Manufacturer Part Number:

    PMEG4010BEA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-76, 2 PIN

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.64 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG4010BEA Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within its specified temperature range (up to 150°C for PMEG4010BEA). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, ensure that the device is properly soldered and that the PCB is designed for high-temperature operation.
  • To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or leads. Use ESD-safe packaging and storage materials, and ensure that the device is properly grounded during handling and assembly.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the device is properly configured and that the output capacitor is suitable for the application. Check for any signs of overheating, and ensure that the device is operated within its specified temperature range.
  • For high-reliability applications, ensure that the device is operated within its specified temperature range and that the PCB is designed for high-reliability operation. Use a reliable and stable input voltage source, and ensure that the device is properly soldered and inspected. Consider using redundant or fault-tolerant designs, and perform thorough testing and validation.

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PMEG4010BEA Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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