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PMEG6002EB,115 - Nexperia

Description: NEXPERIA - PMEG6002EB,115 - DIODE, SCHOTTKY, 200MA, SOD-523-2

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PCB Footprints
PMEG6002EB,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD523
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PMEG6002EB,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD523
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PMEG6002EB,115 Details

  • Manufacturer Part Number:

    PMEG6002EB,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-79, SOD-523, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-02-17

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG6002EB,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, and that the PCB is designed to dissipate heat efficiently. Also, consider using a heat sink or thermal pad to reduce the junction temperature.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (e.g. X5R or X7R) is recommended. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • To troubleshoot issues with the device not regulating the output voltage, check the input voltage, output voltage, and feedback voltage. Ensure that the feedback pin is properly connected and that the output voltage is within the recommended range. Also, check for any signs of overheating or excessive current draw.
  • The recommended output capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (e.g. X5R or X7R) is recommended. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.

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PMEG6002EB,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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