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PMEG6002EJ,115 - Nexperia

Description: Diode 60 V 200mA Surface Mount SOD-523

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PCB Footprints
PMEG6002EJ,115 - Nexperia PCB footprint - Other - Other - PMEG6002EJ,115-4
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3D Models
PMEG6002EJ,115 - Nexperia  - 3D model - Other - PMEG6002EJ,115-4
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PMEG6002EJ,115 Details

  • Manufacturer Part Number:

    PMEG6002EJ,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-90, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323F

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2.75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.045 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.005 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG6002EJ,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended derating curves for the device, and ensure good thermal management through proper PCB design and heat sinking.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device.
  • Yes, the PMEG6002EJ,115 is a high-reliability device suitable for use in automotive and industrial applications. However, it's essential to follow the recommended design and qualification guidelines to ensure the device meets the required reliability standards.
  • To troubleshoot issues with the device, start by checking the input and output voltages, and ensuring that the device is properly soldered and connected. If issues persist, consult the datasheet and application notes for guidance, or contact Nexperia's technical support team.

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PMEG6002EJ,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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