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PMPB19XP,115 - Nexperia

Description: P-Channel 20 V 7.2A (Ta) 1.7W (Ta), 12.5W (Tc) Surface Mount DFN2020MD-6 , 900mV @ 250µA , -55°C ~ 150°C (TJ)

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PCB Footprints
PMPB19XP,115 - Nexperia PCB footprint - Other - Other - DFN2020MD-6 (SOT1220)_2025-1
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3D Models
PMPB19XP,115 - Nexperia  - 3D model - Other - DFN2020MD-6 (SOT1220)_2025-1
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PMPB19XP,115 Details

  • Manufacturer Part Number:

    PMPB19XP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN2020MD-6, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT1220

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    7.2 A

  • Drain-source On Resistance-Max:

    0.0225 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    225 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    12.5 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMPB19XP,115 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and consider derating the device's power handling at high temperatures.
  • The PMPB19XP,115 has internal ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling to prevent damage.
  • Yes, the PMPB19XP,115 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required.
  • Use a combination of visual inspection, voltage and current measurements, and oscilloscope analysis to identify issues. Consult Nexperia's application notes and support resources for guidance.

Trust Checks

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PMPB19XP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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