ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal design, and consider the maximum junction temperature (Tj) of 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock.
While the PMR50HZPJU10L is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure the component is stored in a dry environment, and consider applying a moisture-resistant coating or conformal coating to the PCB.
The expected lifespan of the PMR50HZPJU10L depends on various factors, including operating conditions, temperature, and quality of the component. ROHM estimates a typical lifespan of 10-15 years under normal operating conditions.
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PMR50HZPJU10L Overview
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