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PN5180A0HN/C3Y - NXP

Description: RF Front End High-performance multi-protocol full NFC Forum-compliant frontend

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PCB Footprints
PN5180A0HN/C3Y - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1
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3D Models
PN5180A0HN/C3Y - NXP  - 3D model - Quad Flat No-Lead - SOT618-1
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PN5180A0HN/C3Y Details

  • Manufacturer Part Number:

    PN5180A0HN/C3Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-40

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN5180A0HN/C3Y Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow NXP's application note AN11536 for PCB layout guidelines, and ensure a thermal resistance of <10°C/W for the package. A 4-layer PCB with a solid ground plane and thermal vias is recommended.
  • For reliable NFC antenna design and tuning, follow NXP's application note AN11537, which provides guidelines for antenna design, tuning, and matching. Additionally, use simulation tools like HFSS or CST to optimize antenna performance.
  • For firmware development and debugging, use NXP's PN5180 Software Development Kit (SDK) and follow the guidelines in the PN5180 User Manual. Use a debug probe like the NXP LPC-Link2 or a third-party tool like Segger J-Link for debugging.
  • To ensure compliance with NFC Forum and EMVCo specifications, follow the guidelines in the PN5180 datasheet and application notes. Additionally, use NXP's NFC Forum certified firmware and perform thorough testing and validation according to the relevant specifications.
  • For power management and battery life optimization, use the PN5180's built-in power-saving features like dynamic voltage and frequency scaling, and implement low-power modes like sleep and hibernate. Optimize firmware to minimize power consumption and use a power-efficient antenna design.

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PN5180A0HN/C3Y Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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