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PN5190B1EV/C121E - NXP

Description: RF Front End NFC Frontend supporting challenging RF environment for payment, physical access control.

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PCB Footprints
PN5190B1EV/C121E - NXP PCB footprint - BGA - BGA - VFBGA64
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3D Models
PN5190B1EV/C121E - NXP  - 3D model - BGA - VFBGA64
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PN5190B1EV/C121E Details

  • Manufacturer Part Number:

    PN5190B1EV/C121E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-64

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6.72

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA64,8X8,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    ISO 15693

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.5 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLERS

PN5190B1EV/C121E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching to minimize signal reflections.
  • Implement a robust error correction mechanism, such as CRC and retransmission, and consider using a spread spectrum modulation technique to minimize interference. Additionally, ensure proper shielding and grounding of the PCB.
  • The recommended operating temperature range is -40°C to 85°C. However, the device can tolerate temperatures up to 125°C for short periods during manufacturing or testing.
  • Yes, the PN5190B1EV/C121E is suitable for battery-powered devices due to its low power consumption. However, ensure proper power management and consider using a low-dropout regulator to minimize power consumption.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and verify proper clock and data transmission. Check the device's configuration and register settings, and consult the datasheet and application notes for troubleshooting guidelines.

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PN5190B1EV/C121E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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