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PN7120A0EV/C10801E - NXP

Description: NXP - PN7120A0EV/C10801E - RFID READ/WRITE, 13.56MHZ, VFBGA-49

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Symbol
PN7120A0EV/C10801E - NXP - PCB symbol
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PCB Footprints
PN7120A0EV/C10801E - NXP PCB footprint - BGA - BGA - VFBGA49: plastic very thin fine-pitch ball grid array package; 49 balls
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3D Models
PN7120A0EV/C10801E - NXP - 3D model - BGA - VFBGA49: plastic very thin fine-pitch ball grid array package; 49 balls
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PN7120A0EV/C10801E Details

  • Manufacturer Part Number:

    PN7120A0EV/C10801E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    49

  • Manufacturer Package Code:

    SOT1320-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B49

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA49,7X7,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

PN7120A0EV/C10801E Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the application note AN11835. Additionally, ensure proper thermal management by providing a heat sink and following the thermal design guidelines outlined in the datasheet.
  • Implementing secure boot and secure firmware updates requires using the Secure Boot and Secure Firmware Update features of the PN7120A0EV. Refer to the Secure Boot and Secure Firmware Update application notes (AN11836 and AN11837) for detailed implementation guidelines.
  • For optimal power supply decoupling and filtering, follow the guidelines outlined in the application note AN11838. This includes using a combination of ceramic and electrolytic capacitors, as well as implementing a pi-filter configuration to reduce noise and ripple.
  • To optimize the PN7120A0EV's performance for low-power applications, refer to the Low-Power Optimization application note (AN11839). This includes techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • For optimal NFC performance, follow the antenna design and tuning guidelines outlined in the application note AN11840. This includes selecting the appropriate antenna type, optimizing antenna placement, and tuning the antenna for optimal impedance matching.

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PN7120A0EV/C10801E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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