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PN7150B0HN/C11002Y - NXP

Description: NXP - PN7150B0HN/C11002Y - RFID READ/WRITE, 13.56MHZ, HVQFN-40

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Symbol
PN7150B0HN/C11002Y - NXP - PCB symbol
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PCB Footprints
PN7150B0HN/C11002Y - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN40 (SOT618-1)
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3D Models
PN7150B0HN/C11002Y - NXP - 3D model - Quad Flat No-Lead - HVQFN40 (SOT618-1)
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PN7150B0HN/C11002Y Details

  • Manufacturer Part Number:

    PN7150B0HN/C11002Y

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT618-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN7150B0HN/C11002Y Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use a 50-ohm matched antenna with a quarter-wavelength monopole or dipole design. Ensure the antenna is placed at least 10mm away from the device and other components to minimize interference.
  • Use a 10uF capacitor in parallel with a 100nF capacitor for power supply decoupling. Add a ferrite bead or a pi-filter to reduce electromagnetic interference (EMI).
  • Use a secure boot mechanism like TrustZone or a secure firmware update protocol like HTTPS or CoAP. Implement digital signatures and encryption to ensure the authenticity and integrity of firmware updates.
  • The PN7150B0HN/C11002Y has a built-in thermal shutdown mechanism that disables the device when the junction temperature exceeds 150°C. Implement an external overheating protection mechanism, such as a thermal sensor and a fan, to prevent overheating.

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PN7150B0HN/C11002Y Overview

Use the download button to access the PN7150B0HN/C11002Y schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PN715, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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