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PN7160A1EV/C100K - NXP

Description: RFID Transponders NFC Plug and Play Controller with Integrated Firmware and NCI Interface

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PCB Footprints
PN7160A1EV/C100K - NXP PCB footprint - BGA - BGA - VFBGA64_2022
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3D Models
PN7160A1EV/C100K - NXP  - 3D model - BGA - VFBGA64_2022
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PN7160A1EV/C100K Details

  • Manufacturer Part Number:

    PN7160A1EV/C100K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-64

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    ALSO AVAILABE WITH 3.3V SUPPLY

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA64,8X8,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN7160A1EV/C100K Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the device. Refer to the NXP application note AN11542 for more details.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad of the device. Keep the device away from heat sources, and use a thermal interface material if necessary. Monitor the junction temperature (TJ) to prevent overheating.
  • Critical timing parameters include clock frequency, clock duty cycle, and setup/hold times. Ensure these parameters are met by using a clock source with a stable frequency, and by adding buffers or delay lines if necessary. Verify the timing parameters using an oscilloscope or a logic analyzer.
  • Use a shielded enclosure, and ensure good grounding and decoupling. Add EMI filters or common-mode chokes to the power supply lines. Follow the NXP guidelines for EMI and EMC design, and perform EMI and EMC testing to ensure compliance with relevant standards.
  • The device requires a specific power-on sequence to prevent latch-up or damage. Ensure that the power supplies are sequenced correctly, with the analog supply (VDDA) powered up before the digital supply (VDDD). Use a power management IC or a discrete power sequencing circuit to ensure correct sequencing.

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PN7160A1EV/C100K Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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