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PN7160A1HN/C100E - NXP

Description: NFC/RFID Tags & Transponders NFC Plug and Play Controller with Integrated Firmware and NCI Interface

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PCB Footprints
PN7160A1HN/C100E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1_2022
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3D Models
PN7160A1HN/C100E - NXP  - 3D model - Quad Flat No-Lead - SOT618-1_2022
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PN7160A1HN/C100E Details

  • Manufacturer Part Number:

    PN7160A1HN/C100E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-40

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    ALSO AVAILABE WITH 3.3V SUPPLY

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN7160A1HN/C100E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the device. Refer to the NXP application note AN11542 for more details.
  • Follow the guidelines in the NXP application note AN11542 for PCB layout, component placement, and shielding. Ensure proper grounding, decoupling, and filtering to minimize electromagnetic interference (EMI).
  • Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable and within the recommended voltage ranges before applying the clock signal.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pads. Refer to the NXP application note AN11542 for thermal design guidelines.
  • The critical timing parameters include the clock frequency, clock duty cycle, and setup/hold times for the input signals. Refer to the datasheet for specific timing requirements and ensure that your design meets these parameters.

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PN7160A1HN/C100E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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