PS1740P02CE - TDK

PS1740P02CE Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the PS1740P02CE?
  TDK recommends a 4-layer PCB with a solid ground plane and a separate power plane for the input and output. The input and output capacitors should be placed as close as possible to the device pins, and the PCB traces should be kept short and wide to minimize inductance.
• How do I ensure the reliability of the PS1740P02CE in high-temperature applications?
  To ensure reliability in high-temperature applications, it is recommended to derate the output current and voltage according to the temperature derating curve provided in the datasheet. Additionally, the device should be mounted on a heat sink or a thermal pad to dissipate heat effectively.
• What is the recommended input capacitor type and value for the PS1740P02CE?
  TDK recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
• Can the PS1740P02CE be used in a parallel configuration to increase output current?
  Yes, the PS1740P02CE can be used in a parallel configuration to increase output current. However, it is recommended to use a current-sharing scheme to ensure equal current distribution among the devices. Additionally, the output capacitors should be sized accordingly to handle the increased output current.
• What is the recommended output capacitor type and value for the PS1740P02CE?
  TDK recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF for the output capacitor. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ripple.