PSK-45-15 - CUI Inc.

PSK-45-15 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher is suggested to improve heat transfer between the device and the heat sink.
• How do I ensure reliable operation in high-vibration environments?
  To ensure reliable operation in high-vibration environments, CUI recommends securing the device using a screw or adhesive that can withstand the expected vibration levels. Additionally, the PCB should be designed to minimize flexure and ensure that the device is not subjected to excessive stress or strain.
• What is the maximum allowable voltage derating for this device?
  CUI recommends derating the input voltage by 10% to ensure reliable operation and to account for any voltage tolerances. For example, if the maximum input voltage is 15V, the recommended derated voltage would be 13.5V.
• Can I use this device in a redundant or parallel configuration?
  Yes, the PSK-45-15 can be used in a redundant or parallel configuration to improve system reliability and availability. However, it is essential to ensure that the devices are properly synchronized and that the system is designed to handle the increased power output and heat generation.
• What is the typical MTBF (Mean Time Between Failures) for this device?
  CUI estimates the MTBF for the PSK-45-15 to be around 1.5 million hours at 25°C, based on MIL-HDBK-217F calculations. However, this value may vary depending on the specific application, operating conditions, and environmental factors.