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PSMN004-60B,118 - Nexperia

Description: MOSFET TAPE13 PWR-MOS

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PSMN004-60B,118 - Nexperia PCB footprint - Other - Other - SOT404 (D2PAK)_Thickness=4.5mm
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PSMN004-60B,118 - Nexperia  - 3D model - Other - SOT404 (D2PAK)_Thickness=4.5mm
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PSMN004-60B,118 Details

  • Manufacturer Part Number:

    PSMN004-60B,118

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT404

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.0036 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    550 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    230 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN004-60B,118 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN004-60B,118 is a D2PAK package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure the device operates within the safe operating area (SOA), monitor the device's voltage, current, and power dissipation. Ensure the device is operated within the recommended voltage range (Vds) and current range (Ids) specified in the datasheet.
  • The thermal resistance of PSMN004-60B,118 is Rth(j-a) = 2.5 K/W. This value indicates how efficiently the device can dissipate heat. A lower thermal resistance means better heat dissipation. In the design, ensure proper heat sinking and thermal management to prevent overheating.
  • Yes, PSMN004-60B,118 is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is essential to follow proper design and assembly guidelines to ensure the device operates within its specifications.
  • To protect PSMN004-60B,118 from electrostatic discharge (ESD), handle the device with anti-static materials, use an ESD wrist strap or mat, and ensure the device is stored in an anti-static package. During assembly, use ESD-safe tools and follow proper ESD handling procedures.

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PSMN004-60B,118 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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