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PSMN013-30YLC,115 - Nexperia

Description: MOSFET N-CH 30 V 13.6 MOHMS LOGIC LEVEL MOSFET

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PSMN013-30YLC,115 - Nexperia PCB footprint - Other - Other - PSMN013-30YLC,115-2
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PSMN013-30YLC,115 - Nexperia  - 3D model - Other - PSMN013-30YLC,115-2
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PSMN013-30YLC,115 Details

  • Manufacturer Part Number:

    PSMN013-30YLC,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO8, LFPAK-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.4

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    7 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.0169 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    39 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    26 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN013-30YLC,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN013-30YLC,115 is a standard SOT23 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow Nexperia's guidelines for thermal design and layout, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Yes, PSMN013-30YLC,115 is suitable for high-frequency switching applications up to 100 kHz. However, it is recommended to consult Nexperia's application notes for specific guidance on layout, decoupling, and filtering to minimize electromagnetic interference (EMI).
  • To protect PSMN013-30YLC,115 from ESD, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and to ensure that the device is stored in an ESD-protected environment.
  • Yes, PSMN013-30YLC,115 is qualified for automotive applications and meets the requirements of AEC-Q101. However, it is recommended to consult Nexperia's automotive application notes for specific guidance on design, testing, and validation.

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PSMN013-30YLC,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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