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PSMN016-100YS,115 - Nexperia

Description: N-channel 100 V 16.3 mΩ standard level MOSFET in LFPAK

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PSMN016-100YS,115 - Nexperia PCB footprint - Other - Other - SOT669_2022-1
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PSMN016-100YS,115 - Nexperia  - 3D model - Other - SOT669_2022-1
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PSMN016-100YS,115 Details

  • Manufacturer Part Number:

    PSMN016-100YS,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LFPAK-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.85

  • Additional Feature:

    HIGH EFFICIENCY

  • Avalanche Energy Rating (Eas):

    87 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    51 A

  • Drain-source On Resistance-Max:

    0.0163 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    135 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    117 W

  • Pulsed Drain Current-Max (IDM):

    204 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN016-100YS,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN016-100YS,115 is a DPAK (TO-252) package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow Nexperia's guidelines for thermal design and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
  • The maximum allowed voltage transient for PSMN016-100YS,115 is 120% of the maximum rated voltage (100V) for a duration of less than 100ms.
  • Yes, PSMN016-100YS,115 can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are matched in terms of their electrical characteristics and that the PCB layout is designed to minimize current imbalance.
  • The recommended gate resistor value for PSMN016-100YS,115 is between 10Ω and 100Ω, depending on the specific application requirements and the desired switching speed.

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PSMN016-100YS,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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