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PSMN025-80YLX - Nexperia

Description: MOSFET N-CH 80 V LOGIC LEVEL IN LFPAK

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PCB Footprints
PSMN025-80YLX - Nexperia PCB footprint - Other - Other - SOT669
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3D Models
PSMN025-80YLX - Nexperia  - 3D model - Other - SOT669
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PSMN025-80YLX Details

  • Manufacturer Part Number:

    PSMN025-80YLX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.85

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    45.4 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    37 A

  • Drain-source On Resistance-Max:

    0.027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    103 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    95 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN025-80YLX Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN025-80YLX is a pad size of 1.6 mm x 1.6 mm with a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure reliability in high-temperature applications, ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C, and follow proper thermal management and PCB design guidelines.
  • The maximum allowed voltage on the gate of the PSMN025-80YLX is ±20V, with a recommended maximum voltage of ±15V for reliable operation.
  • To protect the PSMN025-80YLX from ESD, follow proper handling and storage procedures, use ESD-protective packaging and materials, and ensure that the device is properly grounded during assembly and testing.
  • The recommended drive circuit for the PSMN025-80YLX is a non-inverting driver with a resistive load, with a recommended gate resistor value of 10-20 ohms.

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PSMN025-80YLX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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