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PSMN3R9-100YSFX - Nexperia

Description: NextPower 100 V, 4.3 mOhm, 120 A, N-channel MOSFET in LFPAK56E package

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PSMN3R9-100YSFX - Nexperia PCB footprint - Other - Other - PSMN3R9-100YSFX-3
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3D Models
PSMN3R9-100YSFX - Nexperia  - 3D model - Other - PSMN3R9-100YSFX-3
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PSMN3R9-100YSFX Details

  • Manufacturer Part Number:

    PSMN3R9-100YSFX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-1023, SO-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT1023

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    325 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0061 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    75 pF

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    294 W

  • Pulsed Drain Current-Max (IDM):

    690 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN3R9-100YSFX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for PSMN3R9-100YSFX is -55°C to 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of 10°C/W or lower, and ensuring good airflow around the device.
  • A recommended PCB layout for PSMN3R9-100YSFX includes a solid ground plane, short and wide traces for power and ground, and a thermal relief pattern for the heat sink.
  • Yes, PSMN3R9-100YSFX is suitable for high-reliability applications due to its robust design and manufacturing process, which includes burn-in and 100% screening.
  • Handle the device by the body, avoid touching the leads or die, and store it in a dry, ESD-protected environment to prevent damage.

Trust Checks

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Manufacturer Collaborated
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PSMN3R9-100YSFX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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