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PSMNR90-80ASF - Nexperia

Description: N-Channel 80 V 505A (Tc) 1.55kW (Tc) Surface Mount CCPAK1212

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PSMNR90-80ASF - Nexperia - PCB symbol
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PSMNR90-80ASF - Nexperia PCB footprint - Small Outline Packages - Small Outline Packages - SOT8000A
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PSMNR90-80ASF - Nexperia - 3D model - Small Outline Packages - SOT8000A
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PSMNR90-80ASF Details

  • Manufacturer Part Number:

    PSMNR90-80ASF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-8000A, 12 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1890 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    505 A

  • Drain-source On Resistance-Max:

    0.00122 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    278 pF

  • JEDEC-95 Code:

    MO-359

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1550 W

  • Pulsed Drain Current-Max (IDM):

    3558 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMNR90-80ASF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the PSMNR90-80ASF is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • To ensure proper cooling, it's recommended to follow the thermal design guidelines provided in the datasheet. This includes using a heat sink with a thermal resistance of ≤ 10 K/W, ensuring good thermal contact between the device and heat sink, and providing adequate airflow around the device.
  • For optimal performance and reliability, it's recommended to follow the PCB layout guidelines provided in the datasheet. This includes using a multi-layer PCB, placing the device near the power source, and minimizing the length and impedance of the power traces. Additionally, it's essential to ensure good decoupling and to follow proper electromagnetic interference (EMI) design practices.
  • The selection of input and output capacitors depends on the specific application requirements and operating conditions. As a general guideline, it's recommended to use low-ESR capacitors with a voltage rating that exceeds the maximum input voltage. The datasheet provides guidance on the recommended capacitor values and types, but it's essential to consult with a capacitor manufacturer or a qualified engineer for specific recommendations.
  • To ensure reliable assembly and soldering, it's recommended to follow the guidelines provided in the datasheet and industry-standard practices. This includes using a soldering iron with a temperature range of 250°C to 260°C, applying a soldering flux, and avoiding excessive soldering time or temperature. It's also essential to follow proper handling and storage procedures to prevent damage to the device.

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PSMNR90-80ASF Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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