The recommended land pattern for PTCCL13H321HBE is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if high power dissipation is expected.
The maximum operating temperature range for PTCCL13H321HBE is -55°C to 150°C, but derating is required for temperatures above 125°C.
To ensure reliability, follow proper storage and handling procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock.
ESD protection is required for PTCCL13H321HBE, with a recommended human body model (HBM) of 2 kV and a charged device model (CDM) of 500 V.
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PTCCL13H321HBE Overview
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