The recommended land pattern for the PTCTZ3NR100GTT is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a solder mask clearance of 0.15 mm.
The PTCTZ3NR100GTT has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction to the PCB, use thermal vias, and consider using a heat sink or thermal interface material.
The maximum operating temperature range for the PTCTZ3NR100GTT is -55°C to 150°C, with a storage temperature range of -55°C to 150°C.
To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock.
The PTCTZ3NR100GTT has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). Handle the device with ESD-protective equipment and follow proper ESD handling procedures.
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PTCTZ3NR100GTT Overview
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