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PTL30-10G1-103B2 - Bourns

Description: Res Carbon Film POT 10K Ohm 20% 0.1W(1/10W) (45 X 9 X 17mm) Pin Thru-Hole

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PTL30-10G1-103B2 - Bourns PCB footprint - Other - Other - PTL30-10G1-103B2-4
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PTL30-10G1-103B2 - Bourns  - 3D model - Other - PTL30-10G1-103B2-4
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PTL30-10G1-103B2 Details

  • Manufacturer Part Number:

    PTL30-10G1-103B2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.65

  • Actuator Type:

    SLIDE

  • Construction:

    Rectangular

  • Ganging Number:

    1

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    55 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Height:

    7 mm

  • Package Length:

    45 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    PCB Mount

  • Package Width:

    9 mm

  • Rated Power Dissipation (P):

    0.05 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistance Law:

    LINEAR

  • Resistor Type:

    POTENTIOMETER

  • Surface Mount:

    NO

  • Technology:

    CARBON

  • Terminal Shape:

    FLAT

  • Tolerance:

    20%

PTL30-10G1-103B2 Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane and a minimum of 2 oz copper thickness to minimize thermal resistance and ensure optimal performance.
  • The thermal pad should be soldered to a solid copper area on the PCB to ensure good thermal conductivity. A thermal interface material (TIM) can be used to improve thermal performance.
  • The PTL30-10G1-103B2 is rated for operation from -40°C to +150°C, but derating is required above 125°C to ensure reliability.
  • Yes, the PTL30-10G1-103B2 is designed to withstand high-vibration environments, but it's recommended to follow Bourns' guidelines for vibration testing and ensure proper PCB mounting and assembly.
  • Follow Bourns' guidelines for EMC design and ensure proper shielding, grounding, and filtering to minimize electromagnetic interference (EMI) and ensure compliance with relevant standards.

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