Bourns recommends a PCB layout with a solid ground plane and a via to the ground plane directly under the device to minimize inductance and ensure optimal performance.
While the device is rated for operation up to 150°C, it's essential to consider the derating of the device's characteristics, such as clamping voltage and power dissipation, at elevated temperatures. Consult with Bourns' application engineers for specific guidance.
Follow the recommended soldering profile and ensure the device is properly aligned on the PCB. Use a soldering iron with a temperature of 260°C (500°F) and a solder with a melting point of 220°C (428°F) or higher.
Handle the device by the body, avoiding touching the leads or the glass passivation. Store the devices in their original packaging or in a dry, ESD-protected environment to prevent damage from moisture or electrostatic discharge.
While the device is designed for transient voltage suppression, it may not be suitable for high-frequency applications due to its internal capacitance and inductance. Consult with Bourns' application engineers to determine the device's suitability for your specific application.
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PTVS1-058C-H Overview
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