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PU5931FKHP70U2L - Yageo Group

Description: Current Sense Resistors - SMD .0002 ohm 1% 225ppm AEC-Q200

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PU5931FKHP70U2L - Yageo Group - PCB symbol
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PCB Footprints
PU5931FKHP70U2L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - WSLP5931-
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3D Models
PU5931FKHP70U2L - Yageo Group - 3D model - Resistor Chip - WSLP5931-
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PU5931FKHP70U2L Details

  • Manufacturer Part Number:

    PU5931FKHP70U2L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.6

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    1.33 mm

  • Package Length:

    15 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    7.75 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Power Dissipation (P):

    7 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.0002 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    5931

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    225 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.0374 V

PU5931FKHP70U2L Frequently Asked Questions (FAQs)

  • The recommended land pattern for PU5931FKHP70U2L is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the PU5931FKHP70U2L should be placed on a flat surface to prevent warpage. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The component should be cooled down to 150°C within 10 minutes.
  • Yes, the PU5931FKHP70U2L is compatible with lead-free soldering. YAGEO Corporation recommends using a lead-free solder alloy with a melting point of 217°C or higher.
  • The PU5931FKHP70U2L has a moisture sensitivity level (MSL) of 3, according to the IPC/JEDEC J-STD-020 standard. This means that the component can be exposed to a maximum of 30°C/60% RH for 168 hours before soldering.
  • Yes, the PU5931FKHP70U2L is designed to withstand high-vibration environments. However, it's recommended to follow YAGEO Corporation's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.

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PU5931FKHP70U2L Overview

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