The recommended PCB footprint for the PWR163S-25-10R0F is a rectangular pad with dimensions of 2.5 mm x 1.25 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a minimum of 0.5 mm clearance around the component.
To ensure reliable soldering of the PWR163S-25-10R0F, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the PWR163S-25-10R0F is -40°C to 150°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range.
Yes, the PWR163S-25-10R0F is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
Store the PWR163S-25-10R0F in its original packaging or a similar ESD-protective package. Avoid exposing the component to moisture, extreme temperatures, or physical stress during storage and shipping.
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PWR163S-25-10R0F Overview
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