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PYB30-Q24-T515 - CUI Inc.

Description: Isolated DC/DC Converters dc-dc isolated, 30 W, 9 36 Vdc input, 5/+/-15 Vdc, 3000/+/-500 mA, triple regulated output, DIP

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PCB Footprints
PYB30-Q24-T515 - CUI Inc. PCB footprint - Other - Other - PYB30-Q24-T515-1
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3D Models
PYB30-Q24-T515 - CUI Inc.  - 3D model - Other - PYB30-Q24-T515-1
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PYB30-Q24-T515 Details

  • Manufacturer Part Number:

    PYB30-Q24-T515

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    CUI Inc

  • YTEOL:

    0

  • Additional Feature:

    SEATED HEIGHT NOM; ALSO AVAILABLE VOLTAGE: -15VDC/+15VDC

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-MDMA-P7

  • Length:

    50.8 mm

  • Load Regulation-Max:

    2%

  • Number of Functions:

    1

  • Number of Outputs:

    3

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    5.15 V

  • Output Voltage-Min:

    4.85 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    METAL

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,7LEAD,1.8

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    12.05 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    30 W

  • Trim/Adjustable Output:

    NO

  • Width:

    40.6 mm

PYB30-Q24-T515 Frequently Asked Questions (FAQs)

  • CUI recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2 oz copper thickness. A thermal via array under the module can also improve heat dissipation.
  • CUI recommends using a soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30-60 seconds. A nitrogen atmosphere can also help reduce oxidation.
  • CUI recommends keeping the input voltage deviation within ±10% of the nominal input voltage to ensure reliable operation and prevent damage to the module.
  • Check the input voltage, output load, and ambient temperature. Verify that the module is properly soldered and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, the PYB30-Q24-T515 is designed for high-reliability applications. However, it's essential to follow CUI's guidelines for design, testing, and manufacturing to ensure compliance with relevant safety standards.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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PYB30-Q24-T515 Overview

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