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QH03TZ600 - Power Integrations

Description: Diodes - General Purpose, Power, Switching H-Series 600V 3A Super-Low Qrr

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PCB Footprints
QH03TZ600 - Power Integrations PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC-
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3D Models
QH03TZ600 - Power Integrations  - 3D model - Transistor Outline, Vertical - TO-220AC-
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QH03TZ600 Details

  • Manufacturer Part Number:

    QH03TZ600

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC

  • Package Description:

    GREEN PACKAGE-2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    5.42

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Recovery Time-Max:

    0.0098 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

QH03TZ600 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the QH03TZ600 is -40°C to 125°C, as specified in the datasheet. However, it's recommended to derate the device's performance at higher temperatures to ensure reliable operation.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings for the device. The QH03TZ600 requires a minimum of 12V and a maximum of 15V for VCC, and a minimum of 0.5mA and a maximum of 10mA for ICC. Additionally, ensure that the input voltage is within the specified range and that the device is properly decoupled.
  • For optimal thermal management, it's recommended to use a multi-layer PCB with a solid ground plane and to place the QH03TZ600 near a heat sink or a thermal pad. Ensure that the device is properly soldered and that the thermal interface material is applied correctly. Additionally, follow the recommended PCB layout guidelines in the datasheet to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • To troubleshoot issues with the QH03TZ600, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly biased and that the input voltage is within the specified range. Check for any signs of physical damage or overheating, and ensure that the device is properly cooled. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines or contact Power Integrations' technical support for assistance.
  • The QH03TZ600 is a high-reliability device designed for use in a variety of applications, including those that require high reliability and safety. However, it's essential to follow the recommended design and testing guidelines to ensure that the device meets the specific requirements of your application. Additionally, consult with Power Integrations' technical support and review the device's certification and compliance information to ensure that it meets the necessary safety and regulatory standards.

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QH03TZ600 Overview

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