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- Part Number QPL9503TR7
- Manufacturer Qorvo
- Pin Count 9
- Part Category Integrated Circuit
- Package Category Small Outline No-lead
- Footprint Name Small Outline No-lead - DFN package
- Released Date Jul 30, 2018
- Last Modified Date Feb 19, 2025 12:06 PM UTC
- Pinout / Pin List Click Here (Member Only)
QPL9503TR7 Details
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Manufacturer Part Number:
QPL9503TR7
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
DFN-8
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ECCN Code:
5A991.B
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Factory Lead Time:
16 Weeks
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Manufacturer:
Qorvo
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YTEOL:
6.83
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Characteristic Impedance:
50 Ω
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Construction:
COMPONENT
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Gain:
18.5 dB
QPL9503TR7 Frequently Asked Questions (FAQs)
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Qorvo recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
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Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Qorvo provides a reference design and application notes to help with this process.
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Use a reflow soldering process with a peak temperature of 260°C. Ensure the device is handled by the edges to prevent damage to the electrical contacts. Follow Qorvo's recommended assembly and soldering guidelines.
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Monitor the device's voltage, current, and temperature to ensure operation within the specified SOA limits. Implement over-temperature and over-current protection circuits to prevent damage.
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Handle the device with ESD-protective equipment and follow proper ESD handling procedures. The device has built-in ESD protection, but it is not a substitute for proper handling and storage procedures.
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QPL9503TR7 Overview
Use the download button to access the QPL9503TR7 schematic symbol, PCB footprint, and 3D model.
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About Qorvo
Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.