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QS3251QG8 - Renesas Electronics

Description: The QS3251 is a high-speed CMOS TTL-compatible 8:1 multiplexer/ demultiplexer. The QS3251 has 3-state outputs. The QS3251 is a function and pinout compatible version of the 74F251, 74FCT251 and the 74ALS/ AS/LS251 8:1 multiplexers. The low ON resistance of the QS3251 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Mux/Demux devices provide an order of magnitude faster speed than equivalent logic devices. The QS3251 is character

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QS3251QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DCG16-ren1
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QS3251QG8 Details

  • Manufacturer Part Number:

    QS3251QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QSOP

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PCG16

  • Country Of Origin:

    Malaysia, Philippines

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    4.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    9

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    1.5 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3251QG8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients and hotspots.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delay. Ensure that these parameters are met by following the recommended clocking scheme and signal routing guidelines.
  • Power sequencing should follow the recommended power-up and power-down sequences to prevent damage to the device. Reset signals should be asserted and de-asserted according to the recommended timing diagrams.
  • Handle the device by the body or pins, and avoid touching the pins or leads. Use ESD-protective packaging and follow proper handling and storage procedures to prevent damage.

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QS3251QG8 Overview

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