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QS3257QG - Renesas Electronics

Description: The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch version of the 74F257, 74FCT257, and the 74ALS/AS/LS257 Quad 2:1 multiplexers. The low ON resistance of the QS3257 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The QS3257 operates at -40C to +85C.

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QS3257QG - Renesas Electronics - PCB symbol
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PCB Footprints
QS3257QG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP16-ren3
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QS3257QG - Renesas Electronics - 3D model - Small Outline Packages - SSOP16-ren3
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QS3257QG Details

  • Manufacturer Part Number:

    QS3257QG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    PCG16

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    QS3V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3257QG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Critical timing parameters include the input rise and fall times, clock frequency, and setup and hold times. Ensure that these parameters are met by using a clock signal with a stable frequency and amplitude, and by designing the PCB to minimize signal reflections and crosstalk.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-safe components and connectors.
  • The power sequencing requirements are critical to ensure reliable operation. Ensure that the power supplies are sequenced in the correct order, with the core voltage (VCC) being applied before the I/O voltage (VCCIO). Also, ensure that the power supplies are stable and within the recommended voltage range before enabling the device.

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QS3257QG Overview

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