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QS3VH2245QG8 - Renesas Electronics

Description: The QS3VH2245 is a high bandwidth 8-bit bus switch. The QS3VH2245, with 25 ohm ON resistance and 1.35ns propagation delay, is ideal for line matching and low noise environments. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH2245 ideal for high performance communication applications. The QS3VH2245 operates from -40C to +85C.

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QS3VH2245QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - IDTQS3245QG
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QS3VH2245QG8 - Renesas Electronics  - 3D model - Small Outline Packages - IDTQS3245QG
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QS3VH2245QG8 Details

  • Manufacturer Part Number:

    QS3VH2245QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QSOP

  • Package Description:

    QSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PCG20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    8.6868 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    1.35 ns

  • Propagation Delay (tpd):

    1.35 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7272 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

QS3VH2245QG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout and thermal management guide in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • A reliable POR circuit can be implemented using an external voltage supervisor IC or a discrete component circuit. Renesas recommends using a voltage supervisor IC like the RP108 series, which provides a precise POR signal and brown-out detection.
  • To ensure EMI and ESD protection, follow Renesas' guidelines for PCB layout, use EMI filters, and add ESD protection devices like TVS diodes or ESD arrays. Additionally, consider using a shielded enclosure and implementing good grounding practices.
  • Use Renesas' recommended debugging tools, such as logic analyzers and oscilloscopes, to analyze signal integrity and timing. Also, consult the device's datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, increased power consumption, and potentially even device failure. Ensure that your design takes into account the device's thermal characteristics and provides adequate cooling mechanisms.

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QS3VH2245QG8 Overview

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