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QSD2030 - onsemi

Description: Peak Sensitivity l = 880nm; PIN Photodiode; Package type: T-1 3/4 (5mm lens diameter); High Sensitivity; Package material and color: Clear epoxy; Wide Reception Angle, 40°

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PCB Footprints
QSD2030 - onsemi PCB footprint - Other - Other - QSD2030-1
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3D Models
QSD2030 - onsemi  - 3D model - Other - QSD2030-1
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QSD2030 Details

  • Manufacturer Part Number:

    QSD2030

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    T-1 3/4, 5MM PHOTODIODE

  • Manufacturer Package Code:

    100CF

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Additional Feature:

    HIGH SENSITIVITY

  • Configuration:

    SINGLE

  • Dark Current-Max:

    10 nA

  • Infrared Range:

    YES

  • JESD-609 Code:

    e3

  • Light Current-Nom:

    0.015 mA

  • Mounting Feature:

    RADIAL MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    PIN PHOTODIODE

  • Packing Method:

    BAG

  • Peak Wavelength:

    880 nm

  • Reverse Breakdown Voltage-Min:

    50 V

  • Reverse Voltage-Max:

    50 V

  • Semiconductor Material:

    Silicon

  • Shape:

    SQUARE

  • Size:

    1.245 mm

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

QSD2030 Frequently Asked Questions (FAQs)

  • A good PCB layout for the QSD2030 involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. Also, make sure to decouple the power supply with a 10uF capacitor and a 100nF capacitor in parallel, placed close to the device.
  • The QSD2030 supports data rates up to 3.2 Gbps, making it suitable for high-speed applications such as HDMI, DisplayPort, and USB 3.0.
  • The QSD2030 has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer.
  • The QSD2030 has built-in ESD protection, but additional external protection may be necessary depending on the application. A TVS diode or a transient voltage suppressor can be used to protect the device from electrostatic discharge.

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QSD2030 Overview

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