R-781.8-1.0 - RECOM Power

R-781.8-1.0 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use the R-781.8-1.0 in a high-vibration environment?
  Yes, the R-781.8-1.0 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments. However, it's essential to ensure proper mounting and screw torque to prevent damage or disconnection.
• How do I ensure the module's reliability in high-temperature applications?
  To ensure reliability in high-temperature applications, it's crucial to maintain a safe operating temperature range (up to 85°C) and provide adequate cooling. RECOM recommends derating the output power by 2.5% per °C above 60°C to prevent overheating.
• What is the recommended input capacitor value and type for the R-781.8-1.0?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, 50V or higher, as close to the input pins as possible. This helps to filter input noise and ensure stable operation.
• Can I use the R-781.8-1.0 in a redundant or parallel configuration?
  Yes, the R-781.8-1.0 can be used in redundant or parallel configurations to achieve higher power or redundancy. However, it's essential to ensure proper synchronization and ORing diodes to prevent back-feeding and damage to the modules.