Description:R1EX24xxx series are two-wire serial interface EEPROM (Electrically Erasable and Programmable ROM). They realize High-Speed, low power consumption and a high level of reliability by employing advanced MONOS memory technology and CMOS process and low voltage circuitry technology. They also have a 64-byte page programming function to make their write operation faster.
Renesas recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
Renesas recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring the device operates within the specified temperature range (–40°C to +125°C). Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
Renesas recommends using high-frequency, low-ESR capacitors (e.g., 0.1 μF to 1 μF) placed as close as possible to the power pins. The capacitors should be rated for the maximum operating voltage and have a low inductance to minimize noise and voltage droop.
The R1EX24256BSAS0I#K0 has an internal POR and BOR circuitry. Ensure that the power supply ramps up slowly (typically < 10 ms) to allow the POR to function correctly. Also, consider adding external reset circuitry to handle power-on and brown-out conditions, if required by your application.
Renesas recommends following good EMC design practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding or filtering to reduce EMI. Additionally, ensure that the device is operated within the specified frequency range and that clock signals are properly terminated.
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R1EX24256BSAS0I#K0 Overview
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